PCB Assembly Services

PCB Assembly Services

Using the most advanced equipment, highly skilled and experienced personnel, and efficient operations, Four Engineers undertakes all its PCBA manufacturing processes and operations in accordance with ISO 9001/13485/14000 standards and in compliance with IPC-A-600 and IPC-A-610, acceptance of printed board standards. In addition, Four Engineers offers a full range of PCBA testing, as well as serialization, component / high detection, and reverse logistics. Whether ICT, Blue Bed, or Functional, we help our customers determine the appropriate level of testing and follow customer orders, fulfillment models.

Our manufacturing capabilities include:

Custom PCB Assembly
Rigid Board
Rigid-Flex PCB
Flexible PCB & FFC
SMT Assembly
FUJI High Speed Lines Fine Pitch
BGA & Micro BGA X-Ray
01005 Package size capability
PoP – Package on Package
Rework Process and Verification
Through-Hole Assembly
Selective Soldering
Wave Soldering
Lead Forming & Trimming
Press Fit
Rework, Process and Verification
Lead Forming & Trimming Press Fit Rework, Process and Verification

Our Assembly Capabilities

SMT(Surface-Mount Technology) Assembly Lines DIP & Assembly
8 SMT Lines
6 Samsung Lines
2 DIP & Assembly Lines
2 Lines
Order Quantity
1-5000 boards
1-2000 boards
1-1000 boards
1-1000 boards
Parts
MIN Bump Pitch(mm) 0.14
MIN Bump Diameter(mm) 0.07
MIN Bump Gap(mm) 0.07
MIN Bump Pitch(mm) 0.2
MIN Bump Diameter(mm) 0.14
MIN Bump Gap(mm) 0.14
Component Package
Reels, Cut tape, Tube and tay,
Loose parts and bulk
PCB dimensions
Smallest size: 50mm x 50mm
Largest size: 457mm x 356mm
Smallest size: 50mm x 50mm
Largest size: 457mm x 395mm
L1000mm x W400mm
PCB shape
Rectangular
Round
Slots and Cut outs
Rectangular
Round
Slots and Cut outs
Rectangular
Round
Slots and Cut outs
Testing Procedures
X-Ray (DAGE)
AOI (Automated Optical Inspection)
MIRTEC
Stencil printing (DEK)
SPI (CYBER)
ON_LINE AOI (CYBER)
Reflow (Vitronics Solter)
Functional testing

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